Can i add 8 gb ram in the second slot, will it work at its maximum bandwidth ?

srbh

while the first Ram have this specifications

HWiNFO64 Version 6.10-3880

 [Current Computer]
 [Operating System]

Memory --------------------------------------------------------------------

 [General information]
  Total Memory Size:                      4 GBytes
  Total Memory Size [MB]:                 4096
 [Current Performance Settings]
  Maximum Supported Memory Clock:         1066.7 MHz
  Current Memory Clock:                   1063.8 MHz
  Current Timing (tCAS-tRCD-tRP-tRAS):    15-15-15-35
  Memory Channels Supported:              2
  Memory Channels Active:                 1
  Command Rate:                           1T
  Read to Read Delay (tRD_RD) Same Rank:  6T
  Read to Read Delay (tRD_RD) Different Rank: 4T
  Read to Read Delay (tRD_RD) Different DIMM: 7T
  Write to Write Delay (tWR_WR) Same Rank: 6T
  Write to Write Delay (tWR_WR) Different Rank: 4T
  Write to Write Delay (tWR_WR) Different DIMM: 7T
  Read to Write Delay (tRD_WR) Same Rank: 9T
  Read to Write Delay (tRD_WR) Different Rank: 9T
  Read to Write Delay (tRD_WR) Different DIMM: 11T
  Write to Read Delay (tWR_RD) Same Rank (tWTR): 27T
  Write to Read Delay (tWR_RD) Different Rank: 22T
  Write to Read Delay (tWR_RD) Different DIMM: 6T
  RAS# to RAS# Delay (tRRD):              7T
  Refresh Cycle Time (tRFC):              374T
  Four Activate Window (tFAW):            32T

Row: 0 - 4 GB PC4-19200 DDR4 SDRAM Micron Tech. 4ATF51264HZ-2G3B1 ---------

 [General Module Information]
  Module Number:                          0
  Module Size:                            4 GBytes
  Memory Type:                            DDR4 SDRAM
  Module Type:                            SO-DIMM
  Memory Speed:                           1200.5 MHz (DDR4-2400 / PC4-19200)
  Module Manufacturer:                    Micron Tech.
  Module Part Number:                     4ATF51264HZ-2G3B1
  Module Revision:                        3.1
  Module Serial Number:                   1556977683
  Module Manufacturing Date:              Year: 2016, Week: 32
  Module Manufacturing Location:          15
  SDRAM Manufacturer:                     Micron Tech.
  DRAM Steppping:                         4.2
  Error Check/Correction:                 None
 [Module Characteristics]
  Row Address Bits:                       16
  Column Address Bits:                    10
  Module Density:                         8192 Mb
  Number Of Ranks:                        1
  Device Width:                           16 bits
  Bus Width:                              64 bits
  Die Count:                              1
  Module Nominal Voltage (VDD):           1.2 V
  Minimum SDRAM Cycle Time (tCKAVGmin):   0.83300 ns
  Maximum SDRAM Cycle Time (tCKAVGmax):   1.60000 ns
  CAS# Latencies Supported:               10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21
  Minimum CAS# Latency Time (tAAmin):     13.750 ns
  Minimum RAS# to CAS# Delay (tRCDmin):   13.750 ns
  Minimum Row Precharge Time (tRPmin):    13.750 ns
  Minimum Active to Precharge Time (tRASmin): 32.000 ns
  Supported Module Timing at 1200.0 MHz:  17-17-17-39
  Supported Module Timing at 1066.7 MHz:  15-15-15-35
  Supported Module Timing at 933.3 MHz:   13-13-13-30
  Supported Module Timing at 800.0 MHz:   11-11-11-26
  Supported Module Timing at 666.7 MHz:   10-10-10-22
  Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
  Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
  Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
  Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
  Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
  Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 5.300 ns
  Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 6.400 ns
  Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
 [Features]
  Module Temperature Sensor (TSOD):       Not Supported
  Module Nominal Height:                  29 - 30 mm
  Module Maximum Thickness (Front):       1 - 2 mm
  Module Maximum Thickness (Back):        <= 1 mm
  Address Mapping from Edge Connector to DRAM: Standard

Ishy

Hi, @srbh Please provide model number of the device you have for more info.

srbh

Ishy said:

Hi, @srbh Please provide model number of the device you have for more info.

Acer Aspire F5-573G-59V4