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  • Thank you both, AnhEZ28 & JackE, you have both been very helpful. I had no idea that the OEM's these days were using "thermal putty". I am not at all familiar with it. JackE, an excellent observation regarding the height of any thermal pad used, what they are like after being compressed indicates the thickness to be used…
  • Sorry to double post, it wouldn't allow me to edit my reply again. For anyone who has access to the service manual does it indicate the thickness of the thermal pads and/or what the thickness of the pads is for the various locations on the motherboard?
  • Really? Interesting. The gap isn't too large? The gaps above the RAM and VRE chips that interface with the heatsink in previous PH315 designs (such as the PH315-51/52) have been measured to be 1.0 to 1.5 mm in size. That would be a bit much for paste, wouldn't it? Or is the 54 using a different design for the heatsink…
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